Comparing 2D and 3D numerical simulation results of gas flow velocity in...
Soldering & Surface Mount Technology, Volume 26, Issue 4, Page 223-230, August 2014. Purpose – This paper aims to compare and study two-dimensional (2D) and three-dimensional (3D) computational...
View ArticleComparing the reliability and intermetallic layer of solder joints prepared...
Soldering & Surface Mount Technology, Volume 26, Issue 4, Page 214-222, August 2014. Purpose – The purpose of this paper is to compare the reliability and intermetallic layer (IML) of solder joints...
View ArticleEffects of aging on microstructure evolution and mechanical properties of...
Soldering & Surface Mount Technology, Volume 26, Issue 4, Page 203-213, August 2014. Purpose – This paper aims to investigate the transformations during aging at 200°C for different periods on...
View ArticleContamination profile on typical printed circuit board assemblies vs...
Soldering & Surface Mount Technology, Volume 26, Issue 4, Page 194-202, August 2014. Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by...
View ArticleFailure analysis on electrolytic Ni/Au surface finish of PCB used for wire...
Soldering & Surface Mount Technology, Volume 26, Issue 4, Page 180-193, August 2014. Purpose – The purpose of this study is to address two kinds of printed circuit board (PCB) failures with...
View ArticleStudy of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during...
Soldering & Surface Mount Technology, Volume 26, Issue 4, Page 173-179, August 2014. Purpose – The purpose of this study was to comparatively investigate interfacial intermetallic compounds (IMCs)...
View ArticleEffect of intermetallic compound layer thickness on the shear strength of...
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose The purpose of this work is to study the effect of intermetallic compound (IMC) layer thickness on the shear...
View ArticleEffect of Au-Sn IMCs' formation and morphologies on shear properties of laser...
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose The purpose of this paper is to investigate effect of typical morphologies of Au-Sn IMCs (Intermetallic Compounds)...
View ArticleThermal fluid–structure interaction of PCB configurations during the wave...
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose This study aims to investigate the thermal fluid–structure interactions (FSI) of printed circuit boards (PCBs) at...
View ArticleA new approach to investigate conductive anodic filament (CAF) formation
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose This paper describes the development of an approach that uses a flexible substrate to investigate the mechanism of...
View ArticleElectrical and mechanical properties of RFID chip joints assembled on...
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose The aim of this paper is to examine electrical and mechanical properties of RFID chip joints assembled on a flexible...
View ArticleResearch and prospect of binary high-temperature Pb-free solders
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose In terms of micro electronic connection at high temperature, there is a pattern of the coexistence of Sn-Pb and...
View ArticleThermal fatigue reliability for Cu-Pillar bump interconnection in flip chip...
Soldering & Surface Mount Technology, Volume 27, Issue 1, February 2015. Purpose As there is more demand in higher I/O, smaller package size and lower cost, flip chip mounted on module level of...
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