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Channel: Emerald Group Publishing Limited: Soldering & Surface Mount Technology: Table of Contents
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Evaluation of Cu/SnAg Microbump Bonding Processes for 3D Integration Using...

AbstractPurpose - 3D chip stacking is a key technology for 3D integration which two or more chips are stacked with vertical interconnection. In case of multi chip stacking with fine pitch microbump...

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Effect of minor additions of Fe on bulk alloy microstructure and tensile...

AbstractPurpose - This work investigates the effects of small additions (0.1 and 0.3 wt%) of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu lead-free solder...

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SAC 305 solder paste with carbon nanotubes. Part I. Investigation of the...

AbstractPurpose - The purpose of Part I is the manufacturing of the SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after their structure modification and also the influence...

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Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder

AbstractPurpose - To improve the properties of Sn-9Zn solder so as to meet the needs of requires of industrial applications.Design/methodology/approach - Accoring to the key requirments of...

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Interfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu...

AbstractPurpose - A new low-silver solder alloy Sn- x(1.0, 1.5, 2.0)Ag-0.3Cu-3.0Bi-0.05Er (wt.%) (SACBE) was proposed in our former study. The growth behaviours of interfacial IMC layer for Cu/SACBE/Cu...

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Surface finish effect on reliability of SAC 305 soldered chip resistors

AbstractPurpose - To assess the long term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic...

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Cogiscan expands team with new application engineer for Europe

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Research to Industry Electronics Conference: Connecting Research to Industry

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The Institute of Circuit Technology Annual Conference

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13TH JISSO International Council Meeting – Nurnberg, May 2012

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Editorial

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Camtek receives repeated orders totalling approxamtely $5m from one of the...

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UVAX Concepts chooses SIPLACE SX

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OnCore Manufacturing to attend Juki’s 25,000th shipment celebration and tour...

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MIRTEC Europe announces impressive 30 per cent growth in first half of 2012

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PRIDE Industries reaches new level of cleanliness with its new Trident Trio...

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Using Essemtec’s SMD Tower for IGBT storage in a clean room

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iNEMI releases guidelines to reduce risk of creep corrosion

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International diary

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Engineered Material Systems debuts UV cure adhesive for disk drive, camera...

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