Evaluation of Cu/SnAg Microbump Bonding Processes for 3D Integration Using...
AbstractPurpose - 3D chip stacking is a key technology for 3D integration which two or more chips are stacked with vertical interconnection. In case of multi chip stacking with fine pitch microbump...
View ArticleEffect of minor additions of Fe on bulk alloy microstructure and tensile...
AbstractPurpose - This work investigates the effects of small additions (0.1 and 0.3 wt%) of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu lead-free solder...
View ArticleSAC 305 solder paste with carbon nanotubes. Part I. Investigation of the...
AbstractPurpose - The purpose of Part I is the manufacturing of the SAC 305 solder paste with multiwall carbon nanotubes (MWCNT) before and after their structure modification and also the influence...
View ArticleEffect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solder
AbstractPurpose - To improve the properties of Sn-9Zn solder so as to meet the needs of requires of industrial applications.Design/methodology/approach - Accoring to the key requirments of...
View ArticleInterfacial IMC layer growth and tensile properties of low-silver Cu/SACBE/Cu...
AbstractPurpose - A new low-silver solder alloy Sn- x(1.0, 1.5, 2.0)Ag-0.3Cu-3.0Bi-0.05Er (wt.%) (SACBE) was proposed in our former study. The growth behaviours of interfacial IMC layer for Cu/SACBE/Cu...
View ArticleSurface finish effect on reliability of SAC 305 soldered chip resistors
AbstractPurpose - To assess the long term reliability of lead-free Sn96.5Ag3.0Cu0.5 (SAC305) under accelerated temperature cycling (ATC) conditions. Test vehicles consisted of commercial 2512 ceramic...
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